Product Description
The Asscon desoldering system for use in vapor phase soldering machines. Multi-leaded SMD-components, ball grid arrays (BGA’s), connectors as well as mechanical components
may be desoldered correctly and safely.
Advantages:
- Easy to operate
- Economical: purchase and operation
- May be used with every vapor-phase soldering machine
- No damage to components or PCB tracks
- Oxidation-free process during reflow
- Homogeneous and stress-free heating of the assembly
- No over-heating of the component to be desoldered or the assembly
- No wearing parts
- Reproducible process conditions
- After installing a new positioning pin the desoldering system is immediately operational
- Neither special nozzles nor tools needed for different component forms
- Lead-free products may be repaired without problems