Product Description

The Asscon desoldering system for use in vapor phase soldering machines. Multi-leaded SMD-components, ball grid arrays (BGA’s), connectors as well as mechanical components
may be desoldered correctly and safely.

Advantages:

• Easy to operate
• Economical: purchase and operation
• May be used with every vapor-phase soldering machine
• No damage to components or PCB tracks
• Oxidation-free process during reflow
• Homogeneous and stress-free heating of the assembly
• No over-heating of the component to be desoldered or the assembly
• No wearing parts
• Reproducible process conditions
• After installing a new positioning pin the desoldering system is immediately operational
• Neither special nozzles nor tools needed for different component forms
• Lead-free products may be repaired without problems