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Asscon Desoldering Extraction Kit

The Asscon desoldering system for the use in vapor phase soldering machines. Multi-leaded SMD components, ball grid arrays (BGA’s), connectors as well as mechanical components
may be desoldered correctly and safely.g

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Asscon Desoldering Extraction Kit

The Asscon desoldering system for the use in vapor phase soldering machines. Multi-leaded SMD components, ball grid arrays (BGA’s), connectors as well as mechanical components
may be desoldered correctly and safely.g

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Technical Specification

Desoldering Extraction Product Sheet

Product Description

The Asscon desoldering system for use in vapor phase soldering machines. Multi-leaded SMD-components, ball grid arrays (BGA’s), connectors as well as mechanical components
may be desoldered correctly and safely.

Advantages:

  • Easy to operate
  • Economical: purchase and operation
  • May be used with every vapor-phase soldering machine
  • No damage to components or PCB tracks
  • Oxidation-free process during reflow
  • Homogeneous and stress-free heating of the assembly
  • No over-heating of the component to be desoldered or the assembly
  • No wearing parts
  • Reproducible process conditions
  • After installing a new positioning pin the desoldering system is immediately operational
  • Neither special nozzles nor tools needed for different component forms
  • Lead-free products may be repaired without problems