Laser Depaneling

Laser Depaneling is the depanelization process performed using a focused laser beam that ablates the material layer by layer. The laser process within the Laser Inline Routing Machine offers considerable advantages over conventional mechanical cutting processes.

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  • Getech GLSS

    PANEL Size: 350mm x 350mm Thickness: less than 0.6mm for FR4 and Polymide Component Height: 12mm [Subject to review by Getech Engin...
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  • Getech LIRM – Laser Inline Router Machine

    PANEL Size (version 1): 200mm x 200mm Size (version 2): 400mm x 400mm Thickness: Less than 1.6mm for FR4 (design guidelines availab...
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