The cleaning tasks in the electronics producing industry can be differentiated into three segments: Ultrafine Cleaning, Fine Cleaning and Maintenance Cleaning. Ultrafine Cleaning is described as the cleaning of highly sensible components and is an integrated part of the value-added chain. This includes among other the demanding cleaning of assembled PCBs, Hybrids and DCB’s.

Fine Cleaning covers all other cleaning processes that immediately affect the value-added chain. Basic Fine Cleaning includes misprints as well as stencils in metal and PumpPrint-stencils. The differentiation to

Maintenance Cleaning starts with the cleaning of carriers and solder frames and is extended to tools, filters and parts cleaning.

The kolb Application-Indicator shows this differentiation and it indicates the suitability of the respective machines for the different cleaning applications.