Laser Depaneling is the depanelization process performed using a focused laser beam that ablates the material layer by layer. The laser process within the Laser Inline Routing Machine offers considerable advantages over conventional mechanical cutting processes.
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Getech GLSS
Laser Singulation System Designed for high-speed laser depaneling and high-volume production of rigid and semi-flexible PCB panels up to 0...Read more -
Getech IRLD
Inline Rotary Laser Depaneller Designed for high-speed laser depaneling and high-volume production of rigid and semi-flexible PCB panels u...Read more -
Getech LIRM
Laser Inline Routing Machine Inline machine designed for high-speed laser depaneling and high-volume production of rigid and semi-flexible...Read more
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