ASSCON VP6000 with Vacuum (Demo Unit)
ASSCON’s vacuum soldering process combines the average of the vapor-phase with the vaccum process. The vaccum module consists of the evacuation unit mounted in the process chamber where it is secured with quick-locks for fast and easy removal for maintenance. Pump, valves and sensors are integrated in the base.
ASSCON’s vacuum soldering process combines the average of the vapor-phase with the vaccum process. The vaccum module consists of the evacuation unit mounted in the process chamber where it is secured with quick-locks for fast and easy removal for maintenance. Pump, valves and sensors are integrated in the base.
Product Description
ASSCON’s vacuum soldering process combines the average of the vapor-phase with the vaccum process. The vaccum module consists of the evacuation unit mounted in the process chamber where it is secured with quick-locks for fast and easy removal for maintenance. Pump, valves and sensors are integrated in the base.
Advantages:
- Soldering of cased power components on printed circuit boards
- Area reflowing of components on heat-sink plates
- Soldering of power chips on base substrate with paste or solder foils
- Hermetic soldering of high frequency penetrations
- Making solder connections of large area electrical and mechanical components
- Elimination of voids with through-holes or other leaded connections for components to improve heat sinking
- Reflowing of large area SMTs or connectors on multilayers
- Repair of SMTs or conventional connectors in high-multilayers
- Simultaneous soldering of active and power components
- Soldering of 3D assemblies
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